Compared with the single-stage cooling chip, the multi-stage micro-cooling chip can achieve a larger cooling temperature difference, meet the temperature control requirements of a wider working environment temperature range or extremely low working temperature, and meet the more demanding cutting-edge application requirements in aerospace and laser communication fields. It is the embodiment of cutting-edge technology in the field of micro-refrigeration chip manufacturing.
At the beginning of the new year of 2022, Liaoning Lengxin Technology Co., Ltd. successfully developed high-performance multi-stage micro-semiconductor refrigeration chips (D series, T series, etc.), the maximum temperature difference of refrigeration at room temperature reached 100 K (D series) and 125 K (T series), and achieved mass production.

Multi-stage micro-cooling chips require a new material electrical/heat transfer design, more precise dimensional error control and more efficient cooling efficiency, all of which put forward extremely high requirements for the design, preparation, processing, integration, and packaging technologies of key materials for cooling chips . Cold Core Semiconductor (Development and Reform Commission Micro Refrigeration Chip Engineering Research Center) has a strong scientific research and technical team, and has a complete technology research and development platform for micro refrigeration chips, which can be customized according to various actual needs of customers. Temperature control capability, integration density and reduction of its operating power consumption provide customers with optimal solutions and high-quality products.

For more information, please contact:
Dr. Kaiping Tai
Chairman of Liaoning Lengxin Technology Co., Ltd.
Tel: 18640320728 Email: taikaiping@leng-xin.com
On the occasion of the Chinese New Year, Lengxin Technology wishes everyone a happy Chinese New Year, a happy family, a prosperous year of the tiger, and the tiger is prosperous!